In tests, Imec shows the first good results with ASML’s High NA EUV machines. These machines should enable chip production on nodes below 2 nm in the future.
During tests, Imec demonstrates high yields for metal structures built with ASML’s latest High NA EUV machines. These lithography machines should enable the fabrication of chips on nodes below 2 nm in the future. Before that happens, Imec is working with industry partners to learn how to use the machines.
Specifically, Imec shares the success of the first electrical tests, performed on metal structures with a pitch of 20 nanometers and produced with a single exposure via High NA extreme ultraviolet (EUV) lithography. The results confirm the feasibility of this technology for future chip production. They come after an earlier successful test of the machines focusing on DRAM structures.
Confirmation of capabilities
The tests were conducted on so-called serpentine and fork-fork structures and show an electrical yield of more than 90 percent. This indicates a low presence of defects, which is essential for reliable semiconductor production. The measurements represent an important step in validating High NA EUV lithography and its associated processes.
In August 2024, Imec already demonstrated the production of logic and DRAM structures with a single exposure via High NA EUV. The new test results confirm that the process is also suitable for metallized structures at this scale. Imec used a negative tone metal oxide resist (MOR) for this purpose.
Collaboration in the industry
The development of High NA EUV lithography is done in collaboration with various partners, including chip manufacturers, material and mask suppliers, and measurement equipment specialists. According to Imec, the new tests provide important insights into reducing defects and improving the production process.
By combining these results with electron microscopy inspection and conductivity measurements, defect mechanisms such as breaks and bridges can be better analyzed. This helps in further optimizing resists and other process parameters. Imec continues to work on improvements in collaboration with its industrial partners to make High NA EUV suitable for mass production of chips below 2 nanometers.