Intel and Saimemory will jointly develop a new memory technology called Z-Angle Memory. According to the companies, this technology must meet the growing requirements of AI.
Intel and Saimemory, a subsidiary of SoftBank, have announced a collaboration around the Z-Angle Memory (ZAM) program. This should lead to next-generation memory technology, aimed at the rising requirements of AI workloads and high-performance computing.
The goal is to enable more memory capacity, reduce energy consumption, and support new packaging methods. These elements play a role in bottlenecks around scaling AI systems.
Roles and timing
In the collaboration, Intel takes on the role of partner around technology, innovation, and standards. Saimemory brings technology and innovation, and takes on the commercialization of ZAM. The planned timing includes the start of activities in the first quarter of 2026. Prototypes are scheduled for 2027. Commercialization is planned for 2030.
Link with research from AMT program
The technological foundation refers to earlier work within the Advanced Memory Technology (AMT) R&D program. This program is managed by the U.S. Department of Energy and the National Nuclear Security Administration, through Sandia National Laboratory, Lawrence Livermore National Laboratory, and Los Alamos National Laboratory. Intel worked in this context on concept validation around stacked DRAM.
Additionally, the companies refer to Intel’s Next Generation DRAM Bonding initiative. This initiative was meant to demonstrate higher DRAM density and bandwidth, with lower latency and lower energy consumption. Intel states that it wants to use these insights to support the ZAM program with Saimemory. The announcement also places the collaboration in the context of technology partnerships between the U.S. and Japan and the transition from lab research to broader deployment.